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Connectors

 

RADSOK® PowerBlok™

High Amperage, Board Level, Power, R4 RADSOK® Technology

Modern electronics are consuming higher power levels than ever before. Conventional Board level interconnects often trade board space for higher amperage.or increase the thicknesses of copper traces in the PCB or backplane. Other options increase the quantity of the wires in the incoming power cable. Amphenol’s RADSOK® PowerBlok™ provides a simple solution to brining more power to the board.

 

Features & Benefits

·         High Power to Board in a Small Footprint
·         Compact, 0.618 x 0.618 inch Rectangle
·         3.0mm PowerBlok™ carries 30A.
·         Backplane Power Interface with Compliant Pins for Signals
·         TouchProof Cover
·         Eliminates Threaded Fasteners
·         No Special Crimp Tools Needed
·         Application Specifics Pins
·         Radial Socket Design Ensure Multiple Points of Contact
·         Silver Plated Electrical Engagement Area Standard

 

Specifications

·         RoHS Compliant

 

Ph: 888-364-9011  Fax: 520-397-7169 
Email: tech@amphenol-aio.com

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